ID:DA10368809
Intersociety Electronic Packaging Conference, International
INTERpack '95
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sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
American Society of Mechanical Engineers c1995 EEP vol. 10.1-10.2
v. 1 , v. 2
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