CiNii Books Author - American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

1

Packaging, reliability and manufacturing issues associated with electronic and photonic products : presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11-16, 2001, New York, New York

sponsored by the Electronic and Photonic Packaging Division, ASME ; edited by I. Charles Ume ... [et al.]

American Society of Mechanical Engineers c2001 EPP vol. 1

Available at 1 libraries
2

Micro-electro-mechanical systems (MEMS) 2000 : presented at 2000 International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orland, Florida

sponsored by the MEMS Subdivision, ASME ...[et al.] ; edited by Abraham P. Lee ...[et al.]

American Society of Mechanical Engineers c2000 MEMS vol. 2

Available at 1 libraries
3

Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G. J. Kowalski ... [et al.]

American Society of Mechanical Engineers c2000 EEP vol. 28

Available at 1 libraries
4

Micro-electro-mechanical systems (MEMS) 1999 : presented at the 1999 International Mechanical Engineering Congress and Exposition, November 14-19, 1999, Nashville, Tennessee

sponsored by the Fluids Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME, the Heat Transfer Division, ASME, the Bioengineering Division, ASME ; edited by Y. C. Lee ... [et al.]

American Society of Mechanical Engineers c1999 MEMS vol. 1

Available at 1 libraries
5

Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee

American Society of Mechanical Engineers c1999 EEP vol. 26

:set , 1 , 2

Available at 2 libraries
6

Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir

The American Society of Mechanical Engineers c1998 EEP vol. 25

: pbk
7

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh

American Society of Mechanical Engineers c1998 EEP vol. 24

Available at 1 libraries
8

Manufacturing science and engineering, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Manufacturing Engineering Division, ASME ; co-sponsored by the Dynamic Systems and Control Division, ASME, the Electrical and Electronics Packaging Division, ASME ; principal editor, Gloria J. Wiens; contributing editors, Y. Altintas ... [et al.]

American Society of Mechanical Engineers c1997 MED vol. 6

vol. 1 , vol. 2

Available at 1 libraries
9

Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

American Society of Mechanical Engineers c1997 EEP vol. 21

Available at 1 libraries
10

Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu

American Society of Mechanical Engineers c1997 EEP vol. 22 , AMD vol. 226

Available at 2 libraries
11

CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

American Society of Mechanical Engineers c1997 EEP vol. 23 , HTD vol. 356

Available at 1 libraries
12

Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir ... [et al.]

American Society of Mechanical Engineers c1997 EEP vol. 19

:set , 1 , 2

Available at 1 libraries
13

Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read

American Society of Mechanical Engineers c1997 AMD vol. 222 , EEP vol. 20

Available at 2 libraries
14

Structural analysis in microelectronics and fiber optics, 1996 : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

American Society of Mechanical Engineers c1996 EEP vol. 16

Available at 1 libraries
15

Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume

American Society of Mechanical Engineers c1996 EEP vol. 17

Available at 1 libraries
16

Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

American Society of Mechanical Engineers c1996 EEP vol. 18

Available at 1 libraries
17

Microelectromechanical systems (MEMS) : presented at 1996 International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Dynamic Systems and Control Division, ASME ...[et al.]

American Society of Mechanical Engineers c1996 DSC vol. 59

Available at 2 libraries
18

Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh

American Society of Mechanical Engineers c1995 MED vol. 3 , EEP vol. 14

Available at 1 libraries
19

Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.]

American Society of Mechanical Engineers c1995 HTD vol. 319 , EEP vol. 15

Available at 2 libraries
20

Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.]

American Society of Mechanical Engineers c1995 EEP v. 11 , MD v. 64

Available at 1 libraries

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

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