Role of Hydrogen Bond Connecting Ligands for Substrate and Type I Copper in Copper(I) Oxidase CueO
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- Kunishige Kataoka
- Graduate School of Natural Science and Technology, Kanazawa University
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- Takeshi Sakurai
- Graduate School of Natural Science and Technology, Kanazawa University
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Abstract
<jats:title>Abstract</jats:title> <jats:p>Mutational and kinetic studies on Asp439, a ligand for the substrate-binding site in the copper(I) oxidase—CueO—and the deletion mutant—Δα5–7 CueO—indicated that the electron transfer from the copper(I) ion as the substrate to the type I copper is performed though the hydrogen bond between Asp439 and His443, a ligand for the type I copper, and also by means of the through-space mechanism directly.</jats:p>
Journal
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- Chemistry Letters
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Chemistry Letters 42 (9), 1102-1104, 2013-06-08
Oxford University Press (OUP)
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Keywords
Details 詳細情報について
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- CRID
- 1360002219105409664
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- NII Article ID
- 10031194356
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- NII Book ID
- AA00603318
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- ISSN
- 13480715
- 03667022
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- Data Source
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- Crossref
- CiNii Articles
- KAKEN