Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly

Author(s)

• Hwang, Jennie S.

Bibliographic Information

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly

Jennie S. Hwang

Van Nostrand Reinhold, c1989

Note

Includes bibliographies and index

Details

• NCID: BA07273821
• ISBN:
  • 0442207549
• LCCN: 88028015
• Country Code: us
• Title Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xxii, 456 p.
• Size: 24 cm
• Classification:
  • LCC : TK7868.P7
  • DC19 : 621.381/74
• Subject Headings:
  • LCSH : Printed circuits -- Design and construction
  • LCSH : Solder pastes
  • LCSH : Surface mount technology