Heat transfer in electronic and microelectronic equipment
著者
書誌事項
Heat transfer in electronic and microelectronic equipment
（Proceedings of the International Centre for Heat and Mass Transfer, 29）
Hemisphere Pub. Corp., c1990
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注記
Proceedings of a symposium held Aug. 29-Sept. 2, 1988 in Dubrovnik, Yugoslavia
Includes bibliographical references and index
内容説明・目次
内容説明
Examining one of the major heat transfer issues of the decade, this reference volume presents new contributions from international researchers. The volume contains information on thermal control of devices from microelectronic chips in computers to devices for power conversion.
目次
- Cooling electronic equipment - past, present and future, W.Nakayama and A.E.Bergles
- numerical simulation of natural convection in rectangular enclosures with discrete heated elements, G-X.Wang et al
- the detailed analysis of the conductive/convective heat transfer in a single electronics board, Y.Bertin and J.B.Saulnier
- convective heat transfer in electronic apparatus, G.N.Dulnev et al
- closed tow-phase thermosyphon for cooling of high-power semiconductors, M.Lallemand et al
- thermal performance of leadless chip carriers mounted on cored PCBs, P.Jackson.
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