Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

Author(s)

• Chen, W. T.
• Engel, Paul C.
• Jahsman, W. E. (William E.)
• American Society of Mechanical Engineers. Winter Meeting
• American Society of Mechanical Engineers. Applied Mechanics Division
• American Society of Mechanical Engineers. Electronic Packaging Division

Bibliographic Information

Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

sponsored by the Applied Mechanics Division, ASME, the Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman

（AMD, v. 131）（EEP, v. 1）

ASME, c1991

Note

Includes bibliographical references and index

Details

• NCID: BA14250043
• ISBN:
  • 0791808963
• LCCN: 91058586
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y.
• Pages/Volumes: v, 153 p.
• Size: 28 cm
• Classification:
  • LCC : IN PROCESS
• Parent Bibliography ID:
  • BA00053361
  • BA14250087