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EEP (Series)
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関連文献： 29件中 1-20を表示
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- Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G. J. Kowalski ... [et al.]
American Society of Mechanical Engineers c2000 EEP vol. 28
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- Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee
American Society of Mechanical Engineers c1999 EEP vol. 26
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- Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir
The American Society of Mechanical Engineers c1998 EEP vol. 25
: pbk
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- Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh
American Society of Mechanical Engineers c1998 EEP vol. 24
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- Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir
American Society of Mechanical Engineers c1997 EEP vol. 21
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- Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
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sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu
American Society of Mechanical Engineers c1997 EEP vol. 22 , AMD vol. 226
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- CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]
American Society of Mechanical Engineers c1997 EEP vol. 23 , HTD vol. 356
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- Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir ... [et al.]
American Society of Mechanical Engineers c1997 EEP vol. 19
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- Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
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sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read
American Society of Mechanical Engineers c1997 AMD vol. 222 , EEP vol. 20
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- Structural analysis in microelectronics and fiber optics, 1996 : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir
American Society of Mechanical Engineers c1996 EEP vol. 16
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- Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume
American Society of Mechanical Engineers c1996 EEP vol. 17
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- Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]
American Society of Mechanical Engineers c1996 EEP vol. 18
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- Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
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sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
American Society of Mechanical Engineers c1995 MED vol. 3 , EEP vol. 14
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- Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
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sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.]
American Society of Mechanical Engineers c1995 HTD vol. 319 , EEP vol. 15
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- Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
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sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.]
American Society of Mechanical Engineers c1995 EEP v. 11 , MD v. 64
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- Structural analysis in microelectronic and fiber optic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir
American Society of Mechanical Engineers c1995 EEP vol. 12
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- Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
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sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling
American Society of Mechanical Engineers c1995 EEP vol. 13 , AMD vol. 214
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- Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii
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sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
American Society of Mechanical Engineers c1995 EEP vol. 10.1-10.2
v. 1 , v. 2
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- CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by D. Agonafer, R.E. Fulton
American Society of Mechanical Engineers c1994 EEP vol. 9
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- Structural analysis in microelectronics and fiber optics 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir
American Society of Mechanical Engineers c1994 EEP vol. 8
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