Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992

Author(s)

• Joint ASME/JSME Conference on Electronic Packaging
• Chen, William T.
• 阿部, 博之 アベ, ヒロユキ
• American Society of Mechanical Engineers
• 日本機械学会 ニホン キカイ ガッカイ

Bibliographic Information

Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992

sponsored by the American Society of Mechanical Engineers, the Japan Society of Mechanical Engineers ; edited by William T. Chen, Hiroyuki Abe'

（EEP, vol. 1. 1-2）

American Society of Mechanical Engineers, c1992

• v. 1
• v. 2

Details

• NCID: BA18288343
• ISBN:
  • 0791807665
  • 0791807665
• LCCN: 92053846
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York (345 E. 47th St., New York)
• Pages/Volumes: 2 v. (xi, 1015 p.)
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
• Parent Bibliography ID:
  • BA14250087