SMART IV : proceedings : surface mounting and reflow technology, January 11-14, 1988, the Westin Bonaventure, Los Angeles, CA

著者

• SMART
• Electronic Industries Association
• Institute for Interconnecting and Packaging Electronic Circuits

書誌事項

SMART IV : proceedings : surface mounting and reflow technology, January 11-14, 1988, the Westin Bonaventure, Los Angeles, CA

sponsored by: the Electronic Industries Association and the Institute for Interconnecting and Packaging Electronic Circuits

Electronic Industries Association, 1988

詳細情報

• NII書誌ID(NCID): BA18384358
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Washington, D.C.
• ページ数/冊数: 1 v. (various pagings)
• 大きさ: 30 cm