Materials in microelectronic and optoelectronic packaging

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書誌事項

Materials in microelectronic and optoelectronic packaging

edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla

（Ceramic transactions, v. 33）

American Ceramic Society, c1993

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注記

"Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--T.p. verso

Includes bibliographical references and index

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