Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993

Author(s)

• ASME International Electronics Packaging Conference
• Chen, William T.
• Engel, Peter A.
• American Society of Mechanical Engineers

Bibliographic Information

Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993

sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen

（EEP, vol. 4-1）

American Society of Mechanical Engineers, c1993

• NCID: BA21835499
• ISBN:
  • 0791806863
• LCCN: 92053846
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York (345 E. 47th St., New York)
• Pages/Volumes: xi, 550 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
• Parent Bibliography ID:
  • BA14250087