Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993
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Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993
(EEP, vol. 4-1)
American Society of Mechanical Engineers, c1993
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