Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

Author(s)

• International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications
• Schmidt, Martin A.
• Electrochemical Society. Electronics Division
• Electrochemical Society. Dielectric Science and Technology Division

Bibliographic Information

Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

edited by Martin A. Schmidt ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology Divisions

（Proceedings / [Electrochemical Society], v. 93-29）

Electrochemical Society, c1993

Note

Symposium held at Hawaii, May 16-21, 1993

Includes bibliographical references and indexes

Details

• NCID: BA22331898
• ISBN:
  • 1566770688
• LCCN: 93070070
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Pennington, NJ
• Pages/Volumes: x, 485 p.
• Size: 23 cm
• Parent Bibliography ID:
  • BA01323290