Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

著者

• International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications
• Schmidt, Martin A.
• Electrochemical Society. Electronics Division
• Electrochemical Society. Dielectric Science and Technology Division

書誌事項

Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

edited by Martin A. Schmidt ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology Divisions

（Proceedings / [Electrochemical Society], v. 93-29）

Electrochemical Society, c1993

注記

Symposium held at Hawaii, May 16-21, 1993

Includes bibliographical references and indexes

詳細情報

• NII書誌ID(NCID): BA22331898
• ISBN:
  • 1566770688
• LCCN: 93070070
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Pennington, NJ
• ページ数/冊数: x, 485 p.
• 大きさ: 23 cm
• 親書誌ID:
  • BA01323290