Reactive phase formation at interfaces and diffusion processes : proceedings of the International Meeting held in Aussois (France), May 21 - 28, 1993

著者

• Limoge, Y.
• Bocquet, J. L.

書誌事項

Reactive phase formation at interfaces and diffusion processes : proceedings of the International Meeting held in Aussois (France), May 21 - 28, 1993

editors, Y. Limoge and J.L. Bocquet ; sponsored by: CEC ... [et al.]

（Materials science forum, v. 155-156）

Trans Tech Publications, c1994

内容説明・目次

内容説明

In a majority of cases, the various processes which give rise to matter transport lead to the formation of new interfaces and to the concommitant development of new phases on either side of these newly created interfaces. The latter play a particularly important role, in the sense that the reactions that produce the new phases take place there.

目次

Interface Reactions with Formation of a Solid Phase on a Solid Substrate: A Short Overview Reactive Interdiffusion Phase Stability during Growth of Compound Layers Silicides Thin Films Formed by Metal/Silicon Reaction: Role of Diffusion A Linear Phase Growth with Non-Equilibrium Vacancies Modellization of the Growth of Three Intermediate Phases Spectroscopic Studies of Phase Formation and Diffusion Processes at Interfaces Experimental Investigation of Reactive Phase Formation at Interfaces by Ion Beam Techniques TEM and In Situ HREM for Studying Metal-Semiconductor Interfacial Reactions Simulations of Growth Ordering in Semiconductor Alloys Ab Initio Molecular Dynamics Chemical and Topological Structure of Alloy Surfaces: From Equilibrium to Kinetics Atomic Scale Simulations of Solute-Atom Segregation at Grain Boundaries in Binary FCC Alloys Lattice Kinetic Descriptions for Bulk Reaction-Diffusion Processes: Application to Alloys under Irradiation Layer by Layer Dissolution of Ag Deposited on Cu(111) Diffusion in Intermetallic Compounds Recent Developments in Diffusion in Oxides Kinetics of Dissolution of Discontinuous Films into Single Crystal The Appearance of Stresses and their Effects in Diffusion-Reaction Processes in Solids A Method to Constrain Thermodynamic Mixing Properties and Diffusion Data in Multicomponent Solutions Interdiffusion and Unmixing Numerical Calculation of Kirkendall Deformations and Stress Distributions in Thin-Sheet Diffusion Couples Interpretation of Oxygen Tracer Diffusion Profiles in Growing Polycrystalline Oxide Films Point Defect Contribution to Self-Diffusion in Amorphous Metallic Alloys Reaction and Diffusion in Multiphase Systems: Phenomenology and Frames Kinetics of Compounds in Thermodynamic Potential Gradients Diffusion Reactions at Metal/Ceramic and Ceramic/Ceramic Interfaces Metastable Phases and Nuclei: Computer Modeling Order and Disorder at Interfaces Electronic Structure of Interfaces in Relation with Adhesion and Magnetism of Transition Metals Bilayers, Sandwiches and Multilayers (Abstract) On the Interface Transfer Coefficient in Second Phase Growth Models Absolute Atomic Scale Measurements of the Gibbsian Interfacial Excess of Solute at Grain Boundaries in an Iron (Silicon) Alloy The Composition and Structure of the Cu/MgO {222} Heterophase Interface on an Atomic Scale Spatio-Temporal Organization in Reaction-Diffusion Systems Interface Stability during Reactions Flames and Reaction-Diffusion Waves (Abstract) Formation of Metastable Phases by Diffusion Reaction Metastable Phase Formation and Decomposition in Nanomixtures of Immiscible Cu and Fe Defect Injection and Diffusion in Semiconductors The Interface between Polysilicon and Monocrystalline Silicon: Interface Layer and Electrical Characteristic Reactive Wetting by Liquid Metals in Materials Science Diffusive Phase Transformations in Hot Dip Galvanizing Diffusion in the Hf-N System Solid State Reactions and Surface Diffusion in SiC-Ta and SiC-Nb Powder Systems Phases Formed by Interdiffusion between YBCO and (Bi,Pb) Based Compounds The Growth of Silicides in Ni-Si and Ni-SiC Diffusion Couples Reactive Phase Formation in the Diffusion Zone between Si3N4 and Ni-Cr Alloys ROUND TABLE DISCUSSION CONCLUDING REMARKS

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詳細情報

• NII書誌ID(NCID): BA2312889X
• ISBN:
  • 0878496807
• 出版国コード: sz
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Aedermannsdorf
• ページ数/冊数: xv, 582 p.
• 大きさ: 25 cm
• 親書誌ID:
  • BA00294222