Physical design for multichip modules

著者

• Sriram, M. (Mysore)
• Kang, Sung-Mo

書誌事項

Physical design for multichip modules

by M. Sriram, S.M. Kang

（The Kluwer international series in engineering and computer science, SECS 267）

Kluwer Academic Publishers, c1994

注記

Includes bibliographical references (p. 181-191) and index

詳細情報

• NII書誌ID(NCID): BA23201592
• ISBN:
  • 079239450X
• LCCN: 94001108
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Boston
• ページ数/冊数: xi, 197 p.
• 大きさ: 25 cm
• 分類:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Design
  • LCSH : Multichip modules (Microelectronics) -- Design and construction
• 親書誌ID:
  • BA0004729X