Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

Bibliographic Information

Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et al.]

(AMD, vol. 187)

American Society of Mechanical Engineers, c1994

Available at  / 1 libraries

Search this Book/Journal

Related Books: 1-1 of 1

  • AMD

    American Society of Mechanical Engineers

Details

  • NCID
    BA24222805
  • ISBN
    • 0791814270
  • LCCN
    94079149
  • Country Code
    us
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    New York
  • Pages/Volumes
    vi, 229 p.
  • Size
    28 cm
  • Parent Bibliography ID
Page Top