Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

著者

• American Society of Mechanical Engineers. Applied Mechanics Division
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Materials Division
• American Society of Mechanical Engineers. Production Engineering Division
• Japan Society of Mechanical Engineers. Materials and Mechanics Division
• Japan Society of Mechanical Engineers. Computational Mechanics Division
• Schen, Michael A.

書誌事項

Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et al.]

（AMD, vol. 187）

American Society of Mechanical Engineers, c1994

詳細情報

• NII書誌ID(NCID): BA24222805
• ISBN:
  • 0791814270
• LCCN: 94079149
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: vi, 229 p.
• 大きさ: 28 cm
• 親書誌ID:
  • BA00053361