Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

Author(s)

• American Society of Mechanical Engineers. Applied Mechanics Division
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Materials Division
• American Society of Mechanical Engineers. Production Engineering Division
• Japan Society of Mechanical Engineers. Materials and Mechanics Division
• Japan Society of Mechanical Engineers. Computational Mechanics Division
• Schen, Michael A.

Bibliographic Information

Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et al.]

（AMD, vol. 187）

American Society of Mechanical Engineers, c1994

Details

• NCID: BA24222805
• ISBN:
  • 0791814270
• LCCN: 94079149
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: vi, 229 p.
• Size: 28 cm
• Parent Bibliography ID:
  • BA00053361