Mechanics and materials for electronic packaging : volume 1. design and process issues in electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
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Mechanics and materials for electronic packaging : volume 1. design and process issues in electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
(AMD, vol. 195)
American Society of Mechanical Engineers, c1994
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