Microelectronic interconnects and packages, system and process integration

著者

• Tewksbury, Stuart K.
• Carruthers, John R.
• DeFonzo, Alfred P.
• International Symposium on Advances in Interconnection and Packaging
• Society of Photo-optical Instrumentation Engineers
• IEEE Components, Hybrids, and Manufacturing Technology Society
• IEEE Computer Society

書誌事項

Microelectronic interconnects and packages, system and process integration

Stuart K. Tewksbury, John R. Carruthers, conference chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering, cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of the IEEE, Computer Society of the IEEE

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 1390 . International Symposium on Advances in Interconnection and Packaging / Alfred P. DeFonzo, symposium chair/general editor ; bk. 2）

SPIE, c1991

注記

Papers from the International Symposium on Advances in Interconnection and Packaging, held 5-9 Nov. 1990, Boston, Mass.

Includes bibliographical references and index

• NII書誌ID(NCID): BA25812870
• ISBN:
  • 0819404578
• LCCN: 90064022
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Bellingham, Wash.
• ページ数/冊数: x, 582 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7874
  • DC20 : 621.381/046 s
  • DC20 : 621.381/046
• 件名:
  • LCSH : Microelectronic packaging -- Congresses
• 親書誌ID:
  • BA0022700X