Microelectronic interconnects and packages, system and process integration

Author(s)

• Tewksbury, Stuart K.
• Carruthers, John R.
• DeFonzo, Alfred P.
• International Symposium on Advances in Interconnection and Packaging
• Society of Photo-optical Instrumentation Engineers
• IEEE Components, Hybrids, and Manufacturing Technology Society
• IEEE Computer Society

Bibliographic Information

Microelectronic interconnects and packages, system and process integration

Stuart K. Tewksbury, John R. Carruthers, conference chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering, cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of the IEEE, Computer Society of the IEEE

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 1390 . International Symposium on Advances in Interconnection and Packaging / Alfred P. DeFonzo, symposium chair/general editor ; bk. 2）

SPIE, c1991

Note

Papers from the International Symposium on Advances in Interconnection and Packaging, held 5-9 Nov. 1990, Boston, Mass.

Includes bibliographical references and index

Details

• NCID: BA25812870
• ISBN:
  • 0819404578
• LCCN: 90064022
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Bellingham, Wash.
• Pages/Volumes: x, 582 p.
• Size: 28 cm
• Classification:
  • LCC : TK7874
  • DC20 : 621.381/046 s
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Microelectronic packaging -- Congresses
• Parent Bibliography ID:
  • BA0022700X