Integrated circuit quality and reliability
Author(s)
Bibliographic Information
Integrated circuit quality and reliability
（Electrical engineering and electronics, 91）
M. Dekker, c1995
2nd ed., rev. and expanded
- :acid-free paper
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Note
Includes bibliographical references and index
Description and Table of Contents
Description
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Table of Contents
- Overview. Part 1 Introduction to integrated circuit manufacturing processes: front-end IC fabrication operations
- back-end fabrication operations
- in-line process monitors and test structures. Part 2 Impact of new technologies: circuit design trends
- changing fabrication techniques
- packaging technology trends
- electrical testing of VLSICs and ASICs. Part 3 Contamination and manufacturing errors: contamination
- human contamination (people)
- IC processing contamination
- contamination control
- computer-based sources of error in design and test circuit design
- material issues. Part 4 Causes (sources) of IC failures: fabrication-related causes of defects
- packaging and assembly related causes of IC failures
- reliability improvement. Part 5 Introduction to screening: screening.
by "Nielsen BookData"