Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado

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Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado

sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association

(Proceedings / SPIE -- the International Society for Optical Engineering, v. 1986)

International Society for Hybrid Microelectronics , International Electronics Packaging Society, c1993

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1993 proceedings : International Conference and Exhibition on Multichip Modules

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Papers from the Second International Conference and Exhibition on Multichip Modules

Includes bibliographical references

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  • Proceedings

    SPIE -- the International Society for Optical Engineering

    SPIE -- the International Society for Optical Engineering

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