Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado

著者

• International Society for Hybrid Microelectronics
• International Electronics Packaging Society
• International Conference and Exhibition on Multichip Modules

書誌事項

Multichip modules : international conference and exhibition, 14-16 April 1993, Denver, Colorado

sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 1986）

International Society for Hybrid Microelectronics , International Electronics Packaging Society, c1993

タイトル別名

1993 proceedings : International Conference and Exhibition on Multichip Modules

注記

Papers from the Second International Conference and Exhibition on Multichip Modules

Includes bibliographical references

詳細情報

• NII書誌ID(NCID): BA27170184
• ISBN:
  • 0930815378
• LCCN: 94101200
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Reston, Va.,Wheaton, Ill.
• ページ数/冊数: x, 604 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• 件名:
  • LCSH : Multichip modules (Microelectronics) -- Congresses
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
• 親書誌ID:
  • BA0022700X