ULSI technology
著者
書誌事項
ULSI technology
（McGraw-Hill series in electrical and computer engineering）
McGraw-Hill, c1996
- : hard
- : international ed
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注記
Includes bibliographical references and index
内容説明・目次
- 巻冊次
-
: hard ISBN 9780070630628
内容説明
This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter are industry experts, specializing in topics such as epitaxy with low temperature process, rapid thermal processes, low damage plasma reactive ion etching, fine line litography, cleaning technology, clean room technology, packing and reliability.
目次
CHAPTER 1: Cleanroom TechnologyCHAPTER 2: Wafer-Cleaning TechnologyCHAPTER 3: EpitaxyCHAPTER 4: Conventional and Rapid Thermal ProcessesCHAPTER 5: Dielectric and Polysilicon Film DepositionCHAPTER 6: LithographyCHAPTER 7: EtchingCHAPTER 8: MetallizationCHAPTER 9: Process IntegrationCHAPTER 10: Assembly and PackagingCHAPTER 11: Wafer Fab Manufacturing TechnologyCHAPTER 12: ReliabilityAPPENDIX
- 巻冊次
-
: international ed ISBN 9780071141055
内容説明
This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter are industry experts, specializing in topics such as epitaxy with low temperature process, rapid thermal processes, low damage plasma reactive ion etching, fine line lithography, cleaning technology, clean room technology, packing and reliability.
目次
CHAPTER 1: Cleanroom TechnologyCHAPTER 2: Wafer-Cleaning TechnologyCHAPTER 3: EpitaxyCHAPTER 4: Conventional and Rapid Thermal ProcessesCHAPTER 5: Dielectric and Polysilicon Film DepositionCHAPTER 6: LithographyCHAPTER 7: EtchingCHAPTER 8: MetallizationCHAPTER 9: Process IntegrationCHAPTER 10: Assembly and PackagingCHAPTER 11: Wafer Fab Manufacturing TechnologyCHAPTER 12: ReliabilityAPPENDIX
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