High performance design automation for multi-chip modules and packages
著者
書誌事項
High performance design automation for multi-chip modules and packages
（Selected topics in electronics and systems, vol. 5）
World Scientific, c1996
大学図書館所蔵 件 / 全8件
-
該当する所蔵館はありません
- すべての絞り込み条件を解除する
注記
PRIORITY 2
内容説明・目次
内容説明
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
「Nielsen BookData」 より
