1997 Proceedings, 47th Electronic Components & Technology Conference, May 18-21, 1997, San Jose, California

著者

• Electronic Components & Technology Conference
• Components, Packaging & Manufacturing Technology Society
• Electronic Industries Association

書誌事項

1997 Proceedings, 47th Electronic Components & Technology Conference, May 18-21, 1997, San Jose, California

sponsored jointly by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association

IEEE Service Center, c1997

• : softbound
• : casebound

タイトル別名

97CH36048

注記

"IEEE catalog number 97CH36048"--T.p. verso

Includes index

内容説明・目次

内容説明

The papers in this work cover many topics, including not only electronic components, but also developments in all areas of electronic technology. Emerging technologies such as optoelectronic and ballgrid array packaging are reported.

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA32774068
• ISBN:
  • 078033857X
  • 0780338588
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Piscataway, NJ
• ページ数/冊数: 1294 p.
• 大きさ: 28 cm