[sponsored by] IEEE, IEEE Components, Packaging and Manufacturing Technology Society, Wrocław Technical University

IEEE c2005

pbk.

Available at 1 libraries

sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers, Inc.

Institute of Electrical and Electronics Engineers c2005

Available at 1 libraries

sponsored jointly by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA), the Electronic Components Sector of the Electronic Industries Alliance

Institute of Electrical and Electronics Engineers c2005

: set , v. 1 , v. 2

Available at 2 libraries

organized by CPMT ... [et al.] ; sponsored by Surface Mount Technology (Holdings) Limited ... [et al.]

Institute of Electrical and Electronic Engineers c2004

: bound

sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Koneru Ramakrishna ... [et al.]

IEEE Service Center [2004]

v. 1 , v. 2

Available at 1 libraries

sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) Society, Packaging Research Center at Georgia Tech(GT-PRC) ; technical sponsor, Fraunhofer IZM ; general chair, Petri Savolainen ; general chair elect, Jianmin Qu ; technical chair, Petri Savolainen ; technical chair elect, Suresh Sitaraman

IEEE Service Center c2004

Available at 1 libraries

editors: Keyun Bi, Peter G. Barnwell, Jiaji Wang ; sponsored by: Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with: IEEE-CPMT (USA) ... [et al.]

IEEE , China Electronic Packaging Association c2003

Available at 1 libraries

IEEE c2003 2002 ed CPMT transactions compendium

Computer File

Available at 1 libraries

[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]

IEEE Service Center c2003

: softbound

Available at 1 libraries

[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society, NIST

IEEE Service Center c2003

Available at 1 libraries