Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
Author(s)
Bibliographic Information
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
(Electronic packaging and interconnection series)
McGraw-Hill, c1997
- : hc
Available at 1 libraries
  Aomori
  Iwate
  Miyagi
  Akita
  Yamagata
  Fukushima
  Ibaraki
  Tochigi
  Gunma
  Saitama
  Chiba
  Tokyo
  Kanagawa
  Niigata
  Toyama
  Ishikawa
  Fukui
  Yamanashi
  Nagano
  Gifu
  Shizuoka
  Aichi
  Mie
  Shiga
  Kyoto
  Osaka
  Hyogo
  Nara
  Wakayama
  Tottori
  Shimane
  Okayama
  Hiroshima
  Yamaguchi
  Tokushima
  Kagawa
  Ehime
  Kochi
  Fukuoka
  Saga
  Nagasaki
  Kumamoto
  Oita
  Miyazaki
  Kagoshima
  Okinawa
  Korea
  China
  Thailand
  United Kingdom
  Germany
  Switzerland
  France
  Belgium
  Netherlands
  Sweden
  Norway
  United States of America
Note
Includes bibliographical references and index
Description and Table of Contents
Description
Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.
Table of Contents
Introduction.Reliability Testing and Data Analysis.Failure Analysis.Design for Reliability.Solder Joint Reliability of BGA Assemblies.Solder Joint Reliability of Flip Chip Assemblies.Solder Joint Reliability of CSP.Solder Joint Reliability of Fine Pitch SMT Assemblies.
by "Nielsen BookData"