Twenty first IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA
著者
書誌事項
Twenty first IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA
Institute of Electrical and Electronics Engineers , May be purchased from IEEE Service Center, c1997
- : softbound
- : casebound
- タイトル別名
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1997 IEEE/CPMT 21st International Electronics Manufacturing Technology Symposium
97CH36068
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注記
"Sponsored by Semiconductor Equipment & Materials Int'l., the Components, Packaging & Manufacturing Technology Society of the IEEE"--Cover
"IEEE catalog number: 97CH36068"--T.p. verso
Includes bibliographical references and index
内容説明・目次
内容説明
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
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