Composite materials for electronic functions

書誌事項

Composite materials for electronic functions

D.D.L. Chung

(Materials science foundations, 12)

Trans Tech Publications, c2000

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注記

Bibliography: p. 58-77

内容説明・目次

内容説明

Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structural composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for both non-structural and structural composite materials.

目次

Contents 1. Preface. Introduction. 2. Non-Structuralcomposite Materials for Electronic Functions 2.1 Backgroundon Electronic Packaging 2.2 Polymer-Matrix Composites 2.3 Metal-Matrixcomposites 2.4 Carbon-Matrix Composites 2.5 Ceramic-Matrixcomposites 3. Structuralcomposite Materials for Electronic Functions 3.1 Cement-Matrixcomposites for Smart Structures 3.2 Polymer-Matrix Composites for Smartstructures 4. Conclusion Acknowledgement and References

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詳細情報

  • NII書誌ID(NCID)
    BA47071786
  • ISBN
    • 0878498362
  • 出版国コード
    sz
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Uetikon-Zuerich, Switzerland
  • ページ数/冊数
    77 p.
  • 大きさ
    25 cm
  • 親書誌ID
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