Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 : 21-25 July, 1997, Raffles City Convention Centre, Singapore]
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書誌事項
Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 : 21-25 July, 1997, Raffles City Convention Centre, Singapore]
Institute of Electrical and Electronics Engineers, c1997
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- タイトル別名
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6th International Symposium on the Physical & Failure Analysis of Integrated Circuites
6th International Symposium on the Physical & Failure Analysis of Integrated Circuits 1997
IPFA '97
97TH8289
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注記
"IPFA '97 proceedings"--Cover
"IEEE catalog number 97TH8289"
Includes bibliographic references and author index
内容説明・目次
内容説明
Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability, electromigration and die metallization are considered in testing, and analytic approaches to improved reliability.
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