Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 : 21-25 July, 1997, Raffles City Convention Centre, Singapore]

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書誌事項

Proceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '97 : 21-25 July, 1997, Raffles City Convention Centre, Singapore]

edited by M.K. Radhakrishnan, Philip Ho, Chim Wai Kin ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE Electron Device Society ; in co-operation with National University of Singapore Centre for IC Failure Analysis & Reliability, Institute of Microelectronics,Singapore

Institute of Electrical and Electronics Engineers, c1997

  • softbound

タイトル別名

6th International Symposium on the Physical & Failure Analysis of Integrated Circuites

6th International Symposium on the Physical & Failure Analysis of Integrated Circuits 1997

IPFA '97

97TH8289

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注記

"IPFA '97 proceedings"--Cover

"IEEE catalog number 97TH8289"

Includes bibliographic references and author index

内容説明・目次

内容説明

Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability, electromigration and die metallization are considered in testing, and analytic approaches to improved reliability.

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