Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits

Author(s)

• International Symposium on the Physical & Failure Analysis of Integrated Circuits
• Chim, Wai Kin
• Radhakrishnan, M. K.
• Thong, John T. L.
• IEEE Singapore Section. Reliability/CPMT/EDA Chapter
• IEEE Electron Devices Society
• National University of Singapore. Centre for IC Failure Analysis and Reliability
• Institute of Microelectronics

Bibliographic Information

Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits

edited by Chim Wai Kin, M.K. Radhakrishnan, John Thong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technical co-sponsored by IEEE Electron Devices Society ; in co-operation with Centre for IC Failure Analysis & Reliability, National University of Singapore, Institute of Microelectronics, Singapore

Institute of Electrical and Electronics Engineers, c1999

• :softbound

Other Title

99TH8394

7th International Symposium on th Physical & Failure Analysis of Integrated Circuits 1999

IPFA '99

Note

"IEEE catalog number 99TH8394"--T.p. verso

"5-9 July, 1999, Orchard Hotel, Singapore"--Cover

Includes bibliographical references and index

Description and Table of Contents

Description

Aimed at integrated circuit designers, solid state component designers and packaging and manufacturing engineers, these proceedings cover such subjects as: failure analysis technologies; process and device; packaging and metallization; dielectrics; and reliability of specialist devices.

by "Nielsen BookData"

Details

• NCID: BA48948612
• ISBN:
  • 0780351878
• LCCN: 98088539
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Piscataway, NJ
• Pages/Volumes: 209 p.
• Size: 30 cm