書誌事項

Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits

edited by Chim Wai Kin, M.K. Radhakrishnan, John Thong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technical co-sponsored by IEEE Electron Devices Society ; in co-operation with Centre for IC Failure Analysis & Reliability, National University of Singapore, Institute of Microelectronics, Singapore

Institute of Electrical and Electronics Engineers, c1999

  • :softbound

タイトル別名

99TH8394

7th International Symposium on th Physical & Failure Analysis of Integrated Circuits 1999

IPFA '99

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注記

"IEEE catalog number 99TH8394"--T.p. verso

"5-9 July, 1999, Orchard Hotel, Singapore"--Cover

Includes bibliographical references and index

内容説明・目次

内容説明

Aimed at integrated circuit designers, solid state component designers and packaging and manufacturing engineers, these proceedings cover such subjects as: failure analysis technologies; process and device; packaging and metallization; dielectrics; and reliability of specialist devices.

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詳細情報

  • NII書誌ID(NCID)
    BA48948612
  • ISBN
    • 0780351878
  • LCCN
    98088539
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Piscataway, NJ
  • ページ数/冊数
    209 p.
  • 大きさ
    30 cm
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