Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999 , Nashville, Tennessee

書誌事項

Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999 , Nashville, Tennessee

sponsored by the Design Engineering Divsion, ASME ; edited by Erol Sancaktar

(DE, vol. 105)

American Society of Mechanical Engineers, c1999

大学図書館所蔵 件 / 1

この図書・雑誌をさがす

注記

Includes bibliographical references and author index

内容説明・目次

内容説明

Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of

「Nielsen BookData」 より

関連文献: 1件中  1-1を表示

  • DE

    American Society of Mechanical Engineers

    所蔵館1館

詳細情報

ページトップへ