Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999 , Nashville, Tennessee

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Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections : presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999 , Nashville, Tennessee

sponsored by the Design Engineering Divsion, ASME ; edited by Erol Sancaktar

（DE, vol. 105）

American Society of Mechanical Engineers, c1999

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注記

Includes bibliographical references and author index

内容説明・目次

内容説明

Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of

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    American Society of Mechanical Engineers

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