Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
著者
書誌事項
Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
IMAPS , IEEE, [2001]
- : soft.
- タイトル別名
-
International Symposium and Exhibition on Advanced Packaging Materials : processes, properities and interfaces
01TH8562
大学図書館所蔵 件 / 全2件
-
該当する所蔵館はありません
- すべての絞り込み条件を解除する
注記
"Refer to IEEE Catalog Number: 01TH8562" -- T. p. verso
Includes bibliographic references and index
内容説明・目次
内容説明
Topics covered in this book include: active devices; automotive electronics; ball grid array package; chip scale packages; design, modelling, simulation; flex circuits; HDTV; high density packaging; intelligent transportation; interconnects, bonding; and laser processing.
目次
- Active devices
- automative electronics
- ball grid array package
- chip scale packages
- design, modeling, simulation
- flex circuits
- HDTV
- high density packaging
- intelligent transportation
- interconnects, bonding
- laser processing
- management and marketing
- medical electronics
- mircowave packaging
- mobile electronics
- multichip modules
- polymeric materials
- power packaging
- printed wiring boards
- programmes in Mexican maquiladoras
- satellite communications
- sensors
- actuators
- MEMS
- surface mount technology
- thick film materials
- thin film materials
- wireless packaging.
「Nielsen BookData」 より