Stress-induced phenomena in metallization : sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001

Bibliographic Information

Stress-induced phenomena in metallization : sixth International Workshop on Stress-Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001

editors, Shefford P. Baker ... [et al.]

(AIP conference proceedings, v. 612)

American Institute of Physics, c2002

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Includes indexes

Description and Table of Contents

Description

Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.

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Details

  • NCID
    BA5740326X
  • ISBN
    • 073540058X
  • LCCN
    02102851
  • Country Code
    us
  • Title Language Code
    eng
  • Text Language Code
    eng
  • Place of Publication
    Melville, New York
  • Pages/Volumes
    ix, 250 p.
  • Size
    25 cm
  • Parent Bibliography ID
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