MEMS packaging

Author(s)

• Hsu, Tai-Ran
• INSPEC (Information service)

Bibliographic Information

MEMS packaging

edited by Tai-Ran Hsu

（EMIS processing series / Series advisor B.L. Weiss, no. 3）

INSPEC, Institution of Electrical Engineers, c2004

Note

Includes bibliographical references and index

Details

• NCID: BA66668287
• ISBN:
  • 0863413358
• Country Code: uk
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: London
• Pages/Volumes: xxix, 275 p.
• Size: 26 cm
• Classification:
  • DC22 : 621.381
• Subject Headings:
  • LCSH : Microelectromechanical systems
  • LCSH : Microelectronic packaging
• Parent Bibliography ID:
  • BA59159716