Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.

著者

書誌事項

Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.

editors, Sean G. Corcoran ... [et al.]

(Materials Research Society symposium proceedings, v. 795)

Materials Research Society, c2004

タイトル別名

Thin films : stresses and mechanical properties 10

大学図書館所蔵 件 / 5

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注記

Includes bibliographical references and indexes

内容説明・目次

内容説明

Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.

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詳細情報

  • NII書誌ID(NCID)
    BA66862745
  • ISBN
    • 1558997334
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Warrendale, Pa.
  • ページ数/冊数
    xvii, 583 p.
  • 大きさ
    24 cm
  • 親書誌ID
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