2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA

著者

• International Symposium on Advanced Packaging Materials
• Components, Packaging & Manufacturing Technology Society
• Georgia Insitute of Technology, Packaging Research Center
• Fraunhofer Institut Zuverlässigkeit Microintegration
• Qu, Jianmin
• Savolainen, Petri
• Sitaraman, Suresh

書誌事項

2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA

sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) Society, Packaging Research Center at Georgia Tech(GT-PRC) ; technical sponsor, Fraunhofer IZM ; general chair, Petri Savolainen ; general chair elect, Jianmin Qu ; technical chair, Petri Savolainen ; technical chair elect, Suresh Sitaraman

IEEE Service Center, c2004

タイトル別名

2004 9th International Symposium Advanced Packaging Materials : processes, properties, interfaces, March 24-26, 2004, Grand Hyatt, Atlanta, Georgia, USA

04TH8742

注記

"IEEE Catalog Number: 04TH8742" -- T. p. verso

Includes bibliographic references

• NII書誌ID(NCID): BA67149194
• ISBN:
  • 0780384369
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Piscataway, N.J.
• ページ数/冊数: vi, 281 p.
• 大きさ: 28 cm
• 分類:
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Materials Congresses