Stress-induced phenomena in metallization : seventh international workshop on stress-induced phenomena in metallization : Austin, Texas, 14-16 June 2004

Author(s)

• International Workshop on Stress-Induced Phenomena in Metallization
• Ho, P. S.
• Baker, Shefford P.
• Nakayama, Tomoji
• Volkert, Cynthia

Bibliographic Information

Stress-induced phenomena in metallization : seventh international workshop on stress-induced phenomena in metallization : Austin, Texas, 14-16 June 2004

editors, Paul S. Ho ... [et al.]

（AIP conference proceedings, 741）

American Institute of Physics, c2004

Note

Another editors: Shefford P. Baker, Tomoji Nakamura, Cynthia A. Volkert

Includes indexes

Description and Table of Contents

Description

These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. Papers cover results on electromigration, thermal stresses and void formation in copper-low k interconnect structures.

by "Nielsen BookData"

Details

• NCID: BA71166211
• ISBN:
  • 0735402256
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Melville, N.Y.
• Pages/Volumes: vii, 272 p.
• Size: 25 cm
• Parent Bibliography ID:
  • BA00284604