Advances in electronic testing : challenges and methodologies
著者
書誌事項
Advances in electronic testing : challenges and methodologies
(Frontiers in electronic testing)
Springer, c2006
大学図書館所蔵 全5件
  青森
  岩手
  宮城
  秋田
  山形
  福島
  茨城
  栃木
  群馬
  埼玉
  千葉
  東京
  神奈川
  新潟
  富山
  石川
  福井
  山梨
  長野
  岐阜
  静岡
  愛知
  三重
  滋賀
  京都
  大阪
  兵庫
  奈良
  和歌山
  鳥取
  島根
  岡山
  広島
  山口
  徳島
  香川
  愛媛
  高知
  福岡
  佐賀
  長崎
  熊本
  大分
  宮崎
  鹿児島
  沖縄
  韓国
  中国
  タイ
  イギリス
  ドイツ
  スイス
  フランス
  ベルギー
  オランダ
  スウェーデン
  ノルウェー
  アメリカ
注記
Includes bibliographical references and index
内容説明・目次
内容説明
This is a new type of edited volume in the Frontiers in Electronic Testing book series devoted to recent advances in electronic circuits testing. The book is a comprehensive elaboration on important topics which capture major research and development efforts today. "Hot" topics of current interest to test technology community have been selected, and the authors are key contributors in the corresponding topics.
目次
Foreword
by Vishwani D. Agrawal Preface
by Dimitris Gizopoulos Contributing Authors Dedication Chapter 1-Defect-Oriented Testing
by Robert C. Aitken 1.1 History of Defect-Oriented Testing 1.2 Classic Defect Mechanisms 1.3 Defect Mechanisms in Advanced Technologies 1.4 Defects and Faults 1.5 Defect-Oriented Test Types 1.6 Experimental Results 1.7 Future Trends and Conclusions Acknowledgments References Chapter 2-Failure Mechanisms and Testing in Nanometer Technologies
by Jaume Segura, Charles Hawkins and Jerry Soden 2.1 Scaling CMOS Technology 2.2 Failure Modes in Nanometer Technologies 2.3 Test Methods for Nanometer ICs 2.4 Conclusion References Chapter 3-Silicon Debug
by Doug Josephson and Bob Gottlieb 3.1 Introduction 3.2 Silicon Debug History 3.3 Silicon Debug Process 3.4 Debug Flow 3.5 Circuit Failures 3.6 A Case Study in Silicon Debug 3.7 Future Challenges for Silicon Debug 3.8 Conclusion Acknowledgements References Chapter 4-Delay Testing
by Adam Cron 4.1 Introduction 4.2 Delay Test Basics 4.3 Test Application 4.4 Delay Test Details 4.5 Vector Generation 4.6 Chip Design Constructs 4.7 ATE Requirements 4.8 Conclusions: Tests vs. Defects Acknowledgements References Chapter 5-High-Speed Digital Test Interfaces
by Wolfgang Maichen 5.1 New Concepts 5.2 Technology and Design Techniques 5.3 Characterization and Modeling 5.4 Outlook References Chapter 6-DFT-Oriented, Low-Cost Testers
by Al Crouch and GeirEide 6.1 Introduction 6.2 Test Cost - the Chicken and the Low Cost Tester 6.3 Tester Use Models 6.4 Why and When is DFT Low Cost? 6.5 What does Low Cost have to do with the Tester? 6.6 Life, the Universe, and Everything References Recommended Reading Chapter 7-Embedded Cores and System-on-Chip Testing
by Rubin Parekhji 7.1 Embedded Cores and SOCs 7.2 Design and Test Paradigm with Cores and SOCs 7.3 DFT for Embedded Cores and SOCs 7.4 Test Access Mechanisms 7.5 ATPG for Embedded Cores and SOCs 7.6 SOC Test Modes 7.7 Design for At-speed Testing 7.8 Design for Memory and Logic BIST 7.9 Conclusion Acknowledgements References Chapter 8-Embedded Memory Testing
by R. Dean Adams 8.1 Introduction 8.2 The Memory Design Under Test 8.3 Memory Faults 8.4 Memory Test Patterns 8.5 Self Test 8.6 Advanced Memories & Technologies 8.7 Conclusions References Chapter 9-Mixed-Signal Testing and DfT
by Stephen Sunter 9.1 A Brief History 9.2 The State of the Art 9.3 Advances in the Last 10 Years 9.4 Emerging Techniques and Directions 9.5 EDA Tools for Mixed-Signal Testing 9.6 Future Directions References Chapter 10-RF Testing
by Randy Wolf, Mustapha Slamani, John Ferrario and Jayendra Bhagat 10.1 Introduction 10.2 Testing RF ICs 10.3 RF Test Cost Reduction Factors 10.4 Test Hardware 10.5 Hardware Development Process 10.6 High Frequency Simulation Tools 10.7 Device Under Test Interface 10.8 Conclusions Acknowledgements References Chapter 11-Loaded
「Nielsen BookData」 より