Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales

Author(s)

• Luo, Jianfeng
• Dornfeld, D. A.

Bibliographic Information

Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales

Jianfeng Luo, David Dornfeld

Springer, 2004

Note

Includes bibliographical references and index

Details

• NCID: BA7608441X
• ISBN:
  • 354022369X
• LCCN: 2004109174
• Country Code: gw
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Berlin
• Pages/Volumes: xxiv, 311 p.
• Size: 24 cm
• Classification:
  • LCC : TK7874
  • DC22 : 621.3815
• Subject Headings:
  • LCSH : Integrated circuits -- Design and construction
  • LCSH : Integrated circuits -- Design and construction -- Simulation methods