Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales

書誌事項

Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales

Jianfeng Luo, David Dornfeld

Springer, 2004

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注記

Includes bibliographical references and index

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