書誌事項

Semiconductor Wafer Bonding : Science, Technology, and Applications

editors, H. Baumgart ... [et al.] ; sponsoring division, Electronics and Photonics

(ECS transactions, vol. 3, no. 6, vol. 16, no. 8)

Electrochemical Society, c2006-

  • 9
  • 10

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注記

"... held in Cancun, Mexico, as part of the 2006 Fall Meeting of The Electrochemical Society" -- 9

"... held in Honolulu, Hawaii, on October 14-16, 2008, as a part of the Pacific Rim Meeting, PRiME 2008: joint International Meeting of the 214th Meeting of ECS-The Electrochemical Society, and the 2008 Fall Meeting of The Electrochemical Society of Japan" -- 10

Includes bibliographical references and indexes

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詳細情報

  • NII書誌ID(NCID)
    BA81682895
  • ISBN
    • 156677506X
    • 9781566776547
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Pennington, N.J.
  • ページ数/冊数
    v.
  • 大きさ
    23 cm
  • 親書誌ID
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