Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications

著者

• Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications
• Susko, J. R. (John R.)
• Snyder, R. W. (Randy W.)
• Susko, R. A. (Robin A.)
• Electrochemical Society. Dielectrics and Insulation Division
• Electrochemical Society. Electronics Division

書誌事項

Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications

edited by J.R. Susko, R.W. Snyder, R.A. Susko ; [sponsored by] Dielectrics and Insulation and Electronics divisions

（Proceedings / [Electrochemical Society], v. 88-17）

Electrochemical Society, c1988

タイトル別名

Polymeric materials for electronic packaging and high technology applications

注記

Includes bibliographical references and indexes

"... at the Fall meeting October 18-23, 1987, in Honolulu, Hawaii" -- on pref

詳細情報

• NII書誌ID(NCID): BA84960484
• LCCN: 88082251
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Pennington, NJ
• ページ数/冊数: vi, 213 p.
• 大きさ: 23 cm
• 分類:
  • LCC : TK7874
  • DC20 : 621.381/046
• 件名:
  • LCSH : Integrated circuits -- Very large scale integration -- Congresses
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Polymers -- Congresses
• 親書誌ID:
  • BA01323290