16th Symposium on "Microjoining and Assembly Technology in Electronics", February 2-3 2010, Yokohama

Author(s)
Bibliographic Information

16th Symposium on "Microjoining and Assembly Technology in Electronics", February 2-3 2010, Yokohama

溶接学会, 2010.2

Other Title

Mate 2010

第16回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.16, 2010

Proceedings of the 16th Symposium on Microjoining and Assembly Technology in Electronics, vol.16, 2010

Note

Sponsored by Microjoining Commission (JWS)

参考文献あり

Details
  • NCID
    BB04973303
  • ISBN
    • 9784906110155
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    450p
  • Size
    30cm
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