WSPC Series in Advanced Integration and Packaging

Author(s)

    • Bar-Cohen, Avram
    • Lee, Shi-Wei Ricky

Bibliographic Information

WSPC Series in Advanced Integration and Packaging

Series editors, Avram Bar-Cohen, Shi-Wei Ricky Lee

World Scientific

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Details

  • NCID
    BB1511171X
  • Country Code
    si
  • Title Language Code
    eng
  • Text Language Code
    und
  • Place of Publication
    Singapore
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