Low-k nanoporous interdielectrics : materials, thin film fabrications, structures and properties
著者
書誌事項
Low-k nanoporous interdielectrics : materials, thin film fabrications, structures and properties
（Novinka）（Nanotechnology science and technology series）
Nova Science Publishers, c2010
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Low-k nanoporous interdielectrics : materials, thin film fabrications...
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注記
Includes bibliographical references (p. [51]-61) and index
内容説明・目次
内容説明
The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation issues by reducing the capacitance between the interconnect conductor lines. Because of these merits, low-k interdielectric materials are currently in high demand in the development of advanced ICs. One important approach to obtaining low-k values is the incorporation of nanopores into dielectrics. This book provides an overview of the methodologies and characterisation techniques used for investigating low-k nanoporous interdielectrics.
目次
- Introduction
- Recent Developments in Low-K Nanoporous Dielectrics
- Characterization of Pore Structures
- Conclusions
- Index.
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