Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012
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書誌事項
Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012
（AIP conference proceedings, v. 1601）
Curran Associate, c2014
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注記
Includes bibliographical references
Other editors: Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Valeriy Sukharev, Larry Smith, Ehrenfried Zschech
Orginally published: Melville, N.Y. : American Institute of Physics , c2014
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